On 22 April 2026, Bratislava will host the expert seminar Innovations in Thermal Design for Future Power Electronics, focused on current topics in thermal design, power device testing, simulation, AI optimization, and the reliability of power electronics. The seminar builds on the success of its first edition and will once again offer space for expert discussion, practical demonstrations, and networking among representatives of research, industry, and innovation. The event is organized in cooperation with TechSim Engineering CEE, Slovak Chips Competence Centre, Siemens, and the Institute of Electrical Engineering of the Slovak Academy of Sciences. The programme will also feature contributions…
On 22 April 2026, Bratislava will host the expert seminar Innovations in Thermal Design for Future Power Electronics, focused on current topics in thermal design, power device testing, simulation, AI optimization, and the reliability of power electronics.
The seminar builds on the success of its first edition and will once again offer space for expert discussion, practical demonstrations, and networking among representatives of research, industry, and innovation. The event is organized in cooperation with TechSim Engineering CEE, Slovak Chips Competence Centre, Siemens, and the Institute of Electrical Engineering of the Slovak Academy of Sciences.
The programme will also feature contributions from experts connected to the Slovak Chips Competence Centre, focusing on the development of power electronics, testing, simulation, and the future direction of this strategic field. The seminar will provide valuable insights not only for researchers and developers, but also for companies active in semiconductors, power electronics, and innovative technology solutions.
The event is intended for professionals working in power electronics, semiconductors, testing, simulation, and R&D who are looking for new knowledge, inspiration, and opportunities to connect with the expert community.
