Advancing chip technology with Pilot Lines
As part of the Chips for Europe Initiative, the Slovak Chips Competence Centre (SKCCC) is driving the development of a cutting-edge semiconductor infrastructure in Slovakia. These efforts ensure that breakthrough technologies are brought closer to industrial application and commercial deployment.
Pilot lines offer Slovak and European companies access to advanced facilities for testing, prototyping, and validating next-generation semiconductor designs. This includes emerging technologies such as artificial intelligence (AI), quantum computing, cutting-edge packaging and integration technologies, neuromorphic systems, and energy-efficient chips.
They are accessible to startups, SMEs, and industry players under open and non-discriminatory conditions. This inclusive approach strengthens Slovakia’s role in the European semiconductor ecosystem and promotes international collaboration across the value chain.
Pilot Lines Driving European Semiconductor Innovation
APECS
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
APECS focuses on cutting-edge packaging and integration technologies. It delivers expert services and hands-on training for assembling chiplets and electronic components into next-generation systems—enabling innovation across high-performance computing, medical instrumentation, and telecommunications.
Through low-volume, high-value production, APECS facilitates proof-of-concept demonstrations at advanced technology readiness levels.
FAMES
Fully Depleted SOI and Advanced Memory for European Semiconductors
FAMES strengthens Europe’s semiconductor ecosystem by advancing high-performance, energy-efficient, and environmentally sustainable chip solutions. Specializing in FD-SOI (Fully Depleted Silicon-On-Insulator) technologies at 10nm and 7nm nodes, it also integrates embedded non-volatile memories (eNVMs).
Sustainability is at the core, with recyclable materials and optimized processes to reduce environmental impact.
NanoIC
Pioneering Beyond-2nm System-on-Chip Innovation
NanoIC accelerates the development of next-generation SoC (System-on-Chip) technologies beyond the 2nm node. It provides advanced R&D infrastructure and state-of-the-art tools for startups, SMEs, and research institutions.
With early-stage Process Design Kits (PDKs) and prototyping capabilities, NanoIC enables risk mitigation and early validation of new semiconductor features—fueling innovation in materials and fabrication modules.
PIXEurope
Photonics Integration Pilot Line for Europe
PIXEurope is a leading European initiative advancing photonic integrated circuits (PICs). Coordinated by ICFO (Barcelona) with 20 partners from 11 countries—including Sweden—the pilot line supports industrialization of cutting-edge photonics technologies.
By bridging research and industry, PIXEurope promotes widespread adoption of integrated photonics in sectors like telecommunications, AI, healthcare, and automotive—strengthening Europe’s global competitiveness.
WGB Pilot Line
Wide Bandgap Materials for Power Electronics
Led by CNR-IMM (Italy), the WBG Pilot Line focuses on developing durable, high-performance semiconductor materials. Swedish partners include Chalmers, KTH, Linköping University, and Lund University.
Initial phases prioritize materials such as gallium nitride, silicon carbide, gallium oxide, and aluminum nitride.
The pilot line aims to boost the efficiency of Europe’s advanced power devices and establish a robust, locally rooted value chain—enabling new product families with superior features currently unmet by the market.
Other supporting Pilot Lines
Myfab
Sweden’s National Infrastructure for Micro- and Nanofabrication
Myfab is Sweden’s cleanroom-based research network, providing world-class micro- and nanofabrication facilities at Chalmers, KTH, Lund University, and Uppsala University.
Offering access to over 750 tools for processing and characterization, Myfab empowers both academic and industrial innovation across semiconductor technologies.
2D-PL
Industrial Integration of 2D Materials
The 2D Pilot Line supports the industrial adoption of graphene and transition metal dichalcogenides (TMDCs). Through multi-project wafer (MPW) services, it enables prototyping of advanced photonic and electronic devices.
By scaling up 2D materials in semiconductor platforms, 2D-PL helps startups, SMEs, research bodies, and major industry players unlock the potential of next-generation device technologies.
Europractice
Design and Fabrication Services for Integrated Electronics
EUROPRACTICE is a Europe-wide platform offering affordable access to semiconductor design and prototyping services. It provides CAD tools, multi-project wafer (MPW) runs, and training to help innovators develop and manufacture integrated circuits and smart electronic systems.
By supporting startups, SMEs, and research institutions, EUROPRACTICE plays a vital role in reducing development costs, accelerating innovation, and bringing new semiconductor solutions to market.
