The first APECS Open Access Call will open on 1 April 2026 and close on 30 June 2026 at 23:59 CET. It offers stakeholders across the semiconductor value chain a new opportunity to submit project ideas and gain access to selected pilot line technologies, advanced R&D infrastructure, and expert support. APECS is focused on advanced packaging and heterogeneous integration for electronic components and systems. Through its annual open calls, it provides structured and transparent access to cutting-edge technologies that can help organisations validate concepts, speed up development, and bring semiconductor innovations closer to practical deployment. The first call includes access…
The first APECS Open Access Call will open on 1 April 2026 and close on 30 June 2026 at 23:59 CET. It offers stakeholders across the semiconductor value chain a new opportunity to submit project ideas and gain access to selected pilot line technologies, advanced R&D infrastructure, and expert support.
APECS is focused on advanced packaging and heterogeneous integration for electronic components and systems. Through its annual open calls, it provides structured and transparent access to cutting-edge technologies that can help organisations validate concepts, speed up development, and bring semiconductor innovations closer to practical deployment.
The first call includes access to selected technology areas such as:
- CTR Services
- Integration & Packaging Technologies
- Multi Project Wafer (MPW) Runs
- Imaging Technologies, Post-CMOS Photonic Platform & IPD planar components
The call is open to a wide range of participants, including companies, SMEs, start-ups, universities, RTOs, chip foundries, IDMs, and customers. Preferential consideration will be given to projects from SMEs, start-ups, and academic partners, helping widen access to advanced semiconductor capabilities and strengthen Europe’s innovation ecosystem.
Selected applicants will benefit from direct access to state-of-the-art pilot line infrastructure, close cooperation with technology experts, and improved opportunities for testing, validation, and prototyping. In this way, the APECS Open Access Call supports the development of innovative semiconductor solutions and contributes to Europe’s long-term competitiveness.
For organisations in Slovakia, the call represents a valuable opportunity to connect with a broader European semiconductor ecosystem and explore advanced packaging and related pilot line services.
Applications can be submitted from 1 April to 30 June 2026.
