๐๐ฆ๐๐๐ ๐ฎ๐ฌ๐ฎ๐ฒ ๐๐จ ๐๐ค๐ข๐๐ฃ๐ ๐ฉ๐ค ๐ฝ๐ง๐๐ฉ๐๐จ๐ก๐๐ซ๐. The ๐ญ๐ฒ๐๐ต ๐๐ป๐๐ฒ๐ฟ๐ป๐ฎ๐๐ถ๐ผ๐ป๐ฎ๐น ๐๐ผ๐ป๐ณ๐ฒ๐ฟ๐ฒ๐ป๐ฐ๐ฒ on ๐๐ฑ๐๐ฎ๐ป๐ฐ๐ฒ๐ฑ ๐ฆ๐ฒ๐บ๐ถ๐ฐ๐ผ๐ป๐ฑ๐๐ฐ๐๐ผ๐ฟ ๐๐ฒ๐๐ถ๐ฐ๐ฒ๐ ๐ฎ๐ป๐ฑ ๐ ๐ถ๐ฐ๐ฟ๐ผ๐๐๐๐๐ฒ๐บ๐ will take place on ๐ณโ๐ต ๐ข๐ฐ๐๐ผ๐ฏ๐ฒ๐ฟ ๐ฎ๐ฌ๐ฎ๐ฒ ๐ฎ๐ ๐๐ต๐ฒ ๐ฅ๐ฎ๐ฑ๐ถ๐๐๐ผ๐ป ๐๐น๐ ๐๐ฎ๐ฟ๐น๐๐ผ๐ป ๐๐ผ๐๐ฒ๐น ๐ถ๐ป ๐๐ฟ๐ฎ๐๐ถ๐๐น๐ฎ๐๐ฎ, ๐ฆ๐น๐ผ๐๐ฎ๐ธ๐ถ๐ฎ. The conference is ๐ณ๐ผ๐ฐ๐๐๐ฒ๐ฑ ๐ผ๐ป the latest research and development in semiconductor devices, microsystems, materials, and related technologies. Its scope includes topics such as WBG and UWBG materials, semiconductor structures and devices, characterization and modelling, sensors and microsystems, photonics, IC design, packaging technologies, and AI in electronics. ๐๐ฆ๐๐๐ ๐ฎ๐ฌ๐ฎ๐ฒ ๐๐ถ๐น๐น ๐ฏ๐ฟ๐ถ๐ป๐ด ๐๐ผ๐ด๐ฒ๐๐ต๐ฒ๐ฟ researchers, scientists, university experts, doctoral candidates, and industry ๐ฝ๐ฟ๐ผ๐ณ๐ฒ๐๐๐ถ๐ผ๐ป๐ฎ๐น๐ ๐ณ๐ฟ๐ผ๐บ ๐ฎ๐น๐น ๐ผ๐๐ฒ๐ฟ ๐๐ต๐ฒ ๐๐ผ๐ฟ๐น๐ฑ. Giving participants…
๐๐ฆ๐๐๐ ๐ฎ๐ฌ๐ฎ๐ฒ ๐๐จ ๐๐ค๐ข๐๐ฃ๐ ๐ฉ๐ค ๐ฝ๐ง๐๐ฉ๐๐จ๐ก๐๐ซ๐.
The ๐ญ๐ฒ๐๐ต ๐๐ป๐๐ฒ๐ฟ๐ป๐ฎ๐๐ถ๐ผ๐ป๐ฎ๐น ๐๐ผ๐ป๐ณ๐ฒ๐ฟ๐ฒ๐ป๐ฐ๐ฒ on ๐๐ฑ๐๐ฎ๐ป๐ฐ๐ฒ๐ฑ ๐ฆ๐ฒ๐บ๐ถ๐ฐ๐ผ๐ป๐ฑ๐๐ฐ๐๐ผ๐ฟ ๐๐ฒ๐๐ถ๐ฐ๐ฒ๐ ๐ฎ๐ป๐ฑ ๐ ๐ถ๐ฐ๐ฟ๐ผ๐๐๐๐๐ฒ๐บ๐ will take place on ๐ณโ๐ต ๐ข๐ฐ๐๐ผ๐ฏ๐ฒ๐ฟ ๐ฎ๐ฌ๐ฎ๐ฒ ๐ฎ๐ ๐๐ต๐ฒ ๐ฅ๐ฎ๐ฑ๐ถ๐๐๐ผ๐ป ๐๐น๐ ๐๐ฎ๐ฟ๐น๐๐ผ๐ป ๐๐ผ๐๐ฒ๐น ๐ถ๐ป ๐๐ฟ๐ฎ๐๐ถ๐๐น๐ฎ๐๐ฎ, ๐ฆ๐น๐ผ๐๐ฎ๐ธ๐ถ๐ฎ.
The conference is ๐ณ๐ผ๐ฐ๐๐๐ฒ๐ฑ ๐ผ๐ป the latest research and development in semiconductor devices, microsystems, materials, and related technologies. Its scope includes topics such as WBG and UWBG materials, semiconductor structures and devices, characterization and modelling, sensors and microsystems, photonics, IC design, packaging technologies, and AI in electronics.
๐๐ฆ๐๐๐ ๐ฎ๐ฌ๐ฎ๐ฒ ๐๐ถ๐น๐น ๐ฏ๐ฟ๐ถ๐ป๐ด ๐๐ผ๐ด๐ฒ๐๐ต๐ฒ๐ฟ researchers, scientists, university experts, doctoral candidates, and industry ๐ฝ๐ฟ๐ผ๐ณ๐ฒ๐๐๐ถ๐ผ๐ป๐ฎ๐น๐ ๐ณ๐ฟ๐ผ๐บ ๐ฎ๐น๐น ๐ผ๐๐ฒ๐ฟ ๐๐ต๐ฒ ๐๐ผ๐ฟ๐น๐ฑ. Giving participants an opportunity ๐๐ผ ๐ฝ๐ฟ๐ฒ๐๐ฒ๐ป๐ ๐๐ต๐ฒ๐ถ๐ฟ ๐๐ผ๐ฟ๐ธ ๐๐ถ๐๐ต๐ถ๐ป ๐ฎ ๐ฟ๐ฒ๐๐ฝ๐ฒ๐ฐ๐๐ฒ๐ฑ ๐ถ๐ป๐๐ฒ๐ฟ๐ป๐ฎ๐๐ถ๐ผ๐ป๐ฎ๐น ๐ณ๐ผ๐ฟ๐๐บ. Its ๐ถ๐ป๐๐ฒ๐ฟ๐ป๐ฎ๐๐ถ๐ผ๐ป๐ฎ๐น ๐๐ฐ๐ถ๐ฒ๐ป๐๐ถ๐ณ๐ถ๐ฐ ๐ฐ๐ผ๐บ๐บ๐ถ๐๐๐ฒ๐ฒ includes ๐ฒ๐ ๐ฝ๐ฒ๐ฟ๐๐ from leading institutions in multiple countries, and the proceedings will be published by the ๐๐๐๐ ๐๐น๐ฒ๐ฐ๐๐ฟ๐ผ๐ป ๐๐ฒ๐๐ถ๐ฐ๐ฒ๐ ๐ฆ๐ผ๐ฐ๐ถ๐ฒ๐๐.
๐๐ฎ๐น๐น ๐ณ๐ผ๐ฟ ๐ฃ๐ฎ๐ฝ๐ฒ๐ฟ๐ ๐ถ๐ ๐ป๐ผ๐ ๐ผ๐ฝ๐ฒ๐ป. ๐ฌ๐ผ๐ ๐ฐ๐ฎ๐ป ๐ณ๐ถ๐ป๐ฑ ๐ฎ๐น๐น ๐๐ต๐ฒ ๐ถ๐ป๐ณ๐ผ๐ฟ๐บ๐ฎ๐๐ถ๐ผ๐ป ๐ผ๐ป ๐๐ฆ๐๐๐ ๐๐ฒ๐ฏ๐ฝ๐ฎ๐ด๐ฒ: ๐๐๐.๐ฎ๐๐ฑ๐ฎ๐บ.๐๐ธ
๐๐ฏ๐๐๐ฟ๐ฎ๐ฐ๐ ๐๐๐ฏ๐บ๐ถ๐๐๐ถ๐ผ๐ป ๐๐๐ฎ๐ฟ๐๐ฒ๐ฑ ๐ผ๐ป ๐ญ ๐๐ฝ๐ฟ๐ถ๐น ๐ฎ๐ฌ๐ฎ๐ฒ, ๐ฎ๐ป๐ฑ ๐๐ต๐ฒ ๐ฑ๐ฒ๐ฎ๐ฑ๐น๐ถ๐ป๐ฒ ๐ณ๐ผ๐ฟ ๐ฎ๐ฏ๐๐๐ฟ๐ฎ๐ฐ๐๐ ๐ถ๐ ๐ญ ๐๐๐ป๐ฒ ๐ฎ๐ฌ๐ฎ๐ฒ.
๐ช๐ฒ ๐ถ๐ป๐๐ถ๐๐ฒ researchers, scientists, doctoral candidates, and experts from academia working in semiconductor devices, microsystems, materials, photonics, sensors, modelling, packaging, IC design, and related fields to submit their abstracts and become part of ASDAM 2026.
๐๐ผ๐ถ๐ป ๐๐ ๐ถ๐ป ๐๐ฟ๐ฎ๐๐ถ๐๐น๐ฎ๐๐ฎ ๐ฎ๐ป๐ฑ ๐๐ต๐ฎ๐ฟ๐ฒ ๐๐ผ๐๐ฟ ๐ฟ๐ฒ๐๐ฒ๐ฎ๐ฟ๐ฐ๐ต with an international community shaping the future of semiconductors and microsystems.
